Imec demonstrates the first 3D implementation of a charge coupled device for AI memory applications The... 19. Mai 2026 NEWS More
Kioxia mise sur les centres de données face au ralentissement de la demande grand public Kioxia... 30. April 2026 NEWS More
NEO Semiconductor Demonstrates 3D X-DRAM Proof-of-Concept, Secures Strategic Investment to Advance AI Memory NEO... 23. April 2026 NEWS More
Kioxia sets cutoff for legacy NAND, phases out SLC and MLC lines by 2026 Japan-based... 2. April 2026 NEWS More
High-Aspect-Ratio 3D NAND Metrology Equipment Market to Hit USD 1.00 Billion by 2036, Driven by 300-Layer Scaling and Yield Crisis in Advanced Memory Fabs According... 26. März 2026 NEWS More
Micron starts building new 3D NAND fab in Singapore – Fab 10B promises to more than double the company’s local flash production capacity Micron’s... 29. Januar 2026 NEWS More
Western Digital annonce une première mémoire NAND 3D 96 couches en UFS 2.1 pour smartphones Western... 17. Januar 2026 NEWS More